Sri M.C. Kiran

Kiran M C

Designation: Scientist E
Division: PPPT division
3053401222190196
Email: (at)icfre(dot)org

Profile

Areas of Specialization:
Statistics and Development Studies (Sampling, Trend analysis, Forecasting etc.)

Education

B.E (Mechanical)

Research Activities

Testing and Evaluation of products from wood and other lignocellulosic materials.

Analysis of fire retardant doors as per BS 476 & IS 3614.

Development/Rationalization of test methods and procedures for wood products

Standardization of newly developed wood productss

Research Expertise

Development and analysis of wood, wood composite panels and other lignocellulosic products for different end use applications

Projects

Study on Acoustic and Thermal Efficiency of particle boards made from Agro Residues.

To Study the properties of low-density particle board from bamboo for different end use applications.

Statistical Data Analysis on the Properties of Wood Panels

Fatigue strength properties of structural panels

Current Research Projects:

Publications

Kiran M C, Mamatha B S, Anand N, Prakash V, Narashimamurthy "Acoustic and Thermal Behaviour of Low Density Wheat Straw Particle Board"-Published paper in International Journal of Science and Research (IJSR), Volume 7 Issue 9, September 2018, 543 - 547

Kiran M C, B. S. Mamatha, N. Anand, V. Prakash, Narasimhamurthy. "Efficiency of Coir Particle Board for Acoustic & Thermal Applications" - Published paper in International Journal of Science and Research (IJSR), Volume 7 Issue 9, September 2018, 543 – 547

Kiran M.C, Anand Nandanwar, Prakash V, Narasimhamurthy "Fatigue strength properties of Laminated Veneer Lumber and Structural Plywood" -International Journal of Civil and Structural Engineering Research Vol. 8, Issue 1, pp: (117-121), Month: April- Sep 2020

Kiran M C, Anand Nandanwar, M. Venugopal Naidu, K. Ch. Varada Rajulu. “Effect of Density on thermal conductivity of Bamboo Mat Board” -International journal of Agriculture and Forestry, Vol.2 (5). 257-261 September 2012

Achievements

A patent on “Soya based phenolic adhesive composition and a method of preparing the same” patent number 369380